Bio: Tech-related, Sales/AM/BD | TW | ex-Intel, NTUMBA, SCAP, NTUDAC

Bio: I’m a package engineer in semiconductor industry for 7 years and I’m looking for a new opportunity to get new job

Bio: 動物科學背景PM／技術經理，計劃跨領域轉職

Bio: AI/CS background, interested in Pre-sales, PM field. Cats lover🐱 reading, running, yoga🏋️‍♀️

Bio: Hi 👋